1. Zhan Xiaofei（詹晓非）, Shen Chunjian, Zhu Zengwei, Zhu Di. New precision electroforming process for the simultaneous improvement of thickness uniformity and microstructure homogeneity of wafer-scale nanotwinned copper arrays[J]. International Journal of Machine Tools and Manufacture, 2023, 187: 104006.（IF：24.1，被引：21） https://doi.org/10.1016/j.ijmachtools.2023.104006 2. Zhan Xiaofei（詹晓非）, Zhu Zengwei. In situ epitaxial thickening of wafer-scale, highly oriented nanotwinned Ag on tailored polycrystalline Cu substrates[J]. Acta Materialia, 2024, 268: 119792.（IF：10.7，被引：15） https://doi.org/10.1016/j.actamat.2024.119792 3. Zhan Xiaofei（詹晓非）, Jian Lian, Hongjun Li, Xiubin Wang, Jiaan Zhou, Khuong Trieu, Xinping Zhang. Preparation of highly (111) textured nanotwinned copper by medium-frequency pulsed electrodeposition in an additive-free electrolyte[J]. Electrochimica Acta, 2021, 365: 137391.（IF：5.8，被引：93） https://doi.org/10.1016/j.electacta.2020.137391 4. Zhan Xiaofei（詹晓非）, Quoc Dinh Cao, Khuong Trieu, Xinping Zhang. Microstructure and mechanical properties of copper microtubes fabricated via the electroforming process[J]. Journal of Materials Engineering and Performance, 2020, 29: 1741—1750.（IF：2.6，被引：23） https://doi.org/10.1007/s11665-020-04691-3 5. 詹晓非，朱增伟. 太赫兹矩形折叠波导慢波结构铜切片电铸厚度均匀性研究[J]. 真空电子技术，2022（4）：67—72. 6. 刘佳琪，詹晓非，朱增伟. 基于阴极往复运动的TGV电铸铜实心填充工艺[J]. 微纳电子技术，2024，61：030504. 7. 赵帅，朱增伟，刘佳琪，詹晓非. TGV电铸纳米孪晶铜实心填充工艺研究[J].电加工与模具，2026，(S1):46-49. 8.沈志豪，朱增伟，詹晓非. 电铸液喷射速度对电铸铜微观组织及力学性能的影响[J].机械制造与自动化，2024，53(4):20-23.
|
